Global Chip Materials ceramic packages, ceramic packaging, hermetic packaging, IC manufacturers, IC assembly materials, semiconductor materials, microelectronic devices, electronic packaging, Kyocera, NTK, Semi-Alloys, Williams, surface mount devices, IC assembly, chip carriers, Side Braze, DIPs, sidebrazed, Quad Flat Pack, Cerquad, PGA ,Pin Grid Array, LCC, leaded chip carrier, leadless chip carrier, SOIC, small outline integrated circuit Stocking distributor of ceramic packaging materials for microelectronic IC assembly. Online catalog of packaging materials with dimensions and drawings.