Carsem Malaysia turnkey test services for rf, mixed-signal, analog, digital, power, devices, semiconductor testing, system in package, micro leadframe package, fcol, flip chip on leadframe, semiconductors factory, malaysia, flipchip technology, hong leong group bhd, mpi, malaysian pacific industries berhad Carsem provides turnkey packaging and test services to the semiconductor industry. We are a member of the Hong Leong Group in Malaysia.