Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test amkor, amkor technology, system in package, unitive, wafer bump, wafer bumps, flip chip, amkor packaging, wafer level pacakaging, package on package, PoP Amkor Technology, Inc. is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services.