Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA chip to chip bonding, bonding, chip bonding, die bonder, flip chip, direct metallic bonding, metallic bonding, die bonder, device bonder, die bonders, flip-chip bonder, flip chip bonder, bonder, die bonding, flip chip bonding, fluxless eutectic bonding, flip chip, bonding process, assembly, packaging, IR-FPA, die stacking, chip stacking, 3D IC, NIL, FC150, FC300, FC300R, LDP150, NPS300, die stacking, chip stacking, 3D interconnect, 3D integration, metallic bonding, optoelectronic bonding For flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.